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MODELING AND APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING IBD

SPRINGER
05 / 2019
9789811336263
Inglés

Sinopsis

This book systematically discusses the modeling and application ofátransfer manipulationáfor flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of theáequipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field ofámicroelectronics.